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ACT201 数据表(PDF) 1 Page - Advanced Crystal Technology

部件名 ACT201
功能描述  miniature surface mount Watch Crystal
PDF  2 Pages
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制造商  ACT [Advanced Crystal Technology]
网页  http://www.actcrystals.com
标志 ACT - Advanced Crystal Technology

ACT201 数据表(HTML) 1 Page - Advanced Crystal Technology

  ACT201 Datasheet HTML 1Page - Advanced Crystal Technology ACT201 Datasheet HTML 2Page - Advanced Crystal Technology  
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Tel: 0044 (0)118 979 1238
Fax: 0044 (0)118 979 1283
E-mail: info@actcrystals.com
Parameter
Symbol
Specification
Condition
Nominal Frequency
fo
32.768KHz
Frequency Tolerance
Δf/fo
±20ppm
@25°C
Frequency v Temp Characteristics
Δf/fo
See drawing
-10 ~ +60°C
Turnover Temperature
Tm
25°C ±5°C
Freq. Temp. coefficient
β
(3.5 ±0.8) x 10-8/°C² max
Temp Operating Range
Topr
-40 ~ +85°C
Temp Storage Range
Tstg
-55 ~ +125°C
Equivalent Series Resistance
ESR
50K
Ω max
@25°C
Shunt Capacitance
Co
1.0pF Typical
Load Capacitance
CL
12.5pF
Motional Capacitance
C1
2.1fF Typical
Drive Level
DL
1
μW max
Insulation Resistance
IR
500M
Ω min
@DC100v
Aging (first year)
Fa
±5ppm
@25°C
In line with our ongoing policy of product evolvement and improvement, the above specification may be subject to change without notice.
3 The Business Centre, Molly Millars Lane, Wokingham, Berkshire, RG41 2EY, UK
http://www.actcrystals.com
Customer to specify : Frequency Tolerance, Load Capacitance, Operating Temperature Range & Storage Temperature Range
ISO9001:2000 Registered
For quotations or further information please contact us at:
Please note that all parameters can not necessarily be specified in the same device
ACT201
Specification
The ACT201 is a miniature surface mount Watch Crystal whose low power consumption makes it
ideal for portable applications. It’s size makes it suitable for high density circuit boards or
applications where space is limited and the tape and reel packaging means that it is ideal for
automatic placement machines.
The heart of the device is a heat resistant cylinder type crystal which gives it high
stability characteristics sufficient to allow reflow soldering. The epoxy based encapsulation makes it
less porous than the ACT200 and, therefore, better suited to post reflow washing
-20 -10
0
+10 +20 +30 +40 +50 +60
0
-10
-20
-30
-40
-50
-60
Δ f/f (ppm)
Temperature °C
Typical Temperature Characteristics
Suggested F ootprint
8.7 max
3.7 max
5.5
2.5 max
0.5 mm ± 0.1
1.15 ± 0.2
4.2
1.3
1.8
1.0
Dimensions in mm
Issue : 4 I3
Date : 17/08/04
2 of 2


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