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STP16DP05 数据表(PDF) 15 Page - STMicroelectronics |
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STP16DP05 数据表(HTML) 15 Page - STMicroelectronics |
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15 / 29 page ![]() STP16DP05 Typical characteristics 15/29 Figure 14. Power dissipation vs temperature package Note: The exposed pad should be soldered to the PBC to realize the thermal benefits. Figure 13. IDD ON\OFF 0 2 4 6 8 10 12 14 0 10 203040 506070 8090 Iset (mA) IddON Avg @ 5.5V IddON Avg @ 3.6V IddOFF Avg @ 5.5V IddOFF Avg @ 3.6V |
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