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AS1108

Datasheet - A b s o l u t e M a x i m u m R a t i n g s

5 Absolute Maximum Ratings

Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only,

and functional operation of the device at these or any other conditions beyond those indicated in Section 6 Electrical

Characteristics on page 4 is not implied. Exposure to absolute maximum rating conditions for extended periods may

affect device reliability.

Table 2. Absolute Maximum Ratings

Parameter

Min

Max

Units

Notes

Electrical Parameters

VDD to GND

-0.3

7

V

All other pins to GND

-0.3

VDD + 0.3

(max 7V)

V

Current

DIG 0:DIG 3 Sink Current

500

mA

SEG A:SEG G, SEG DP

100

mA

Latch-Up Immunity

±200

mA

All pins except AS1108 pin 11: ±180 mA

Norm: JEDEC 78

Electrostatic Discharge

Digital outputs

1000

V

Norm: MIL 883 E method 3015

All other pins

1000

V

Continuous Power Dissipation (TA = +85°C)

Wide SOIC

941

mW

Derate 11.8mW/ºC

above +70ºC

Temperature Ranges and Storage Conditions

Storage Temperature Range

-55

+150

ºC

Package Body Temperature (Wide SOIC)

+260

ºC

The reflow peak soldering temperature (body

temperature) specified is in accordance with IPC/

JEDEC J-STD-020 “Moisture/Reflow Sensitivity

Classification for Non-Hermetic Solid State Surface

Mount Devices”.

The lead finish for Pb-free leaded packages is

matte tin (100% Sn).

Humidity

5

85

%

Non-condensing

Moisture Sensitive Level

3

Represents a max. floor life time of 168h