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AS1102-T 数据表(PDF) 13 Page - ams-OSRAM AG |
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AS1102-T 数据表(HTML) 13 Page - ams-OSRAM AG |
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13 / 15 page ![]() www.austriamicrosystems.com Revision 1.5 11 - 13 AS1101/AS1102/AS1103/AS1104 Data Sheet - Package Drawings and Mark ings Figure 21. MSOP-8 Package Symbol Millimeters ± Tolerance Symbol Millimeters ± Tolerance A 1.10 Max b 0.33 +0.07 to -0.08 A1 0.10 ±0.05 b1 0.30 ±0.05 A2 0.86 ±0.08 c 0.18 ±0.05 D 3.00 ±0.10 c1 0.15 +0.03 to -0.02 D2 2.95 ±0.10 θ1 3.0º ±3.0º E4.90 ±0.15 θ2 12.0º ±3.0º E1 3.00 ±0.10 θ3 12.0º ±3.0º E2 2.95 ±0.10 L 0.55 ±0.15 E3 0.51 ±0.13 L1 0.95 BSC E4 0.51 ±0.13 aaa 0.10 R 0.15 +0.15 to -0.08 bbb 0.08 R1 0.15 +0.15 to -0.08 ccc 0.25 t1 0.31 ±0.08 e .65 BSC t2 0.41 ±0.08 S .525 BSC Notes: 1. All dimensions are in millimeters (angle in degrees), unless otherwise specified. 2. Datums B and C to be determined at datum plane H. 3. Dimensions D and E1 are to be determined at datum plane H. 4. Dimensions D2 and E2 are for top package and D and E1 are for bottom package. 5. Cross section A-A to be determined at 0.13 to 0.25mm from the lead tip. 6. Dimensions D and D2 do not include mold flash, protrusion, or gate burrs. 7. Dimension E1 and E2 do not include interlead flash or protrusion. |
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