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EXAMPLE STENCIL DESIGN

(18X 0.5)

20X (1.45)

20X (0.3)

(4.4)

(R0.05) TYP

VSSOP - 1.1 mm max height

DGS0020A

SMALL OUTLINE PACKAGE

4226367/A 10/2020

NOTES: (continued)

11. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

12. Board assembly site may have different recommendations for stencil design.

SOLDER PASTE EXAMPLE

BASED ON 0.125 mm THICK STENCIL

SCALE: 16X

SYMM

SYMM

1

10

11

20