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EGA2000-850-UW

Soldering & Storage Information

Datasheet

• PUBLIC

DS000695

• v4-00 • 2023-Apr-04

24

│ 18

9

Soldering & Storage Information

9.1

Soldering Information

The EGA2000-850-UW modules have been tested for lead-free solder reflow compatibility with peak

temperatures up to 260 °C.

Although an example reflow profile is provided in the following figure, the exact reflow profile may

depend on exact solder used.

Figure 20:

Solder Reflow Profile Graph Example (for reference only)

Attention

●

It is not advised to proceed to cleaning after SMT reflow process.

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The modules MUST NOT be cleaned using ultrasonic cleaning.

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We suggest to use

“no clean solder paste” and not to clean after SMT.

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In case a cleaning is un-avoidable, rinse with DI water, followed by a 2h bake @70 °C.