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ISO6041HDFPR 数据表(PDF) 46 Page - Texas Instruments |
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ISO6041HDFPR 数据表(HTML) 46 Page - Texas Instruments |
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46 / 52 page  www.ti.com EXAMPLE BOARD LAYOUT .002 MAX [0.05] ALL AROUND .002 MIN [0.05] ALL AROUND (.213) [5.4] 14X (.0250 ) [0.635] 16X (.063) [1.6] 16X (.016 ) [0.41] SHRINK SMALL-OUTLINE PACKAGE SSOP - 1.75 mm max height DBQ0016A 4214846/A 03/2014 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. METAL SOLDER MASK OPENING NON SOLDER MASK DEFINED OPENING SOLDER MASK DETAILS SOLDER MASK METAL SOLDER MASK DEFINED SCALE:8X LAND PATTERN EXAMPLE SYMM 1 8 9 16 SEE DETAILS ISO6041 SLLSFV3A – DECEMBER 2025 – REVISED MARCH 2026 www.ti.com 46 Submit Document Feedback Copyright © 2026 Texas Instruments Incorporated Product Folder Links: ISO6041 |
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