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Package characteristics

In order to meet environmental requirements, ST offers these devices in ECOPACK®

package. The package has a lead-free second level interconnect. The category of second

Level Interconnect is marked on the package and on the inner box label, in compliance with

JEDEC standard JESD97. The maximum ratings related to soldering conditions are also

marked on the inner box label.

ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.