P01 Series

5/6

Fig. 10:

On-state

characteristics (maximum

values).

Fig. 11: SOT-223 Thermal resistance junction to

ambient versus copper surface under tab (Epoxy

printed circuit board FR4, copper thickness:

35

µm).

Ω

ITM(A)

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

1E+1

1E+0

1E-1

1E-2

VTM(V)

Rth(j-a) (°C/W)

S (cm )

2

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

130

120

110

100

90

80

70

60

50

40

30

20

10

0

PACKAGE MECHANICAL DATA

TO-92 (Plastic)

D

F

a

E

B

A

C

REF.

DIMENSIONS

Millimeters

Inches

Min.

Typ.

Max.

Min.

Typ.

Max.

A

1.35

0.053

B

4.70

0.185

C

2.54

0.100

D

4.40

0.173

E

12.70

0.500

F

3.70

0.146

a

0.50

0.019