TS971-TS972-TS974

Package information

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3

Package information

packages. These packages have a lead-free second level interconnect. The category of

second level interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an ST trademark.

3.1

SOT23-5 package information

Figure 13.

SOT23-5 package mechanical drawing

Table 4.

SOT23-5 package mechanical data

Ref.

Millimeters

Mils

Min.

Typ.

Max.

Min.

Typ.

Max.

A

0.90

1.45

35.4

57.1

A1

0.00

0.15

0.00

5.9

A2

0.90

1.30

35.4

51.2

b

0.35

0.50

13.7

19.7

C

0.09

0.20

3.5

7.8

D

2.80

3.00

110.2

118.1

E

2.60

3.00

102.3

118.1

E1

1.50

1.75

59.0

68.8

e

0.95

37.4

e1

1.9

74.8

L

0.35

0.55

13.7

21.6