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MPC860EC 数据表(PDF) 75 Page - Freescale Semiconductor, Inc |
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MPC860EC 数据表(HTML) 75 Page - Freescale Semiconductor, Inc |
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75 / 80 page ![]() MPC860 PowerQUICC™ Family Hardware Specifications, Rev. 8 Freescale Semiconductor 75 Mechanical Data and Ordering Information Figure 78 shows the mechanical dimensions of the ZQ PBGA package. Figure 78. Mechanical Dimensions and Bottom Surface Nomenclature of the ZQ PBGA Package NOTE 1. All Dimensions in millimeters. 2. Dimensions and tolerance per ASME Y14.5M, 1994. 3. Maximum Solder Ball Diameter measured parallel to Datum A. 4. Datum A, the seating plane, is defined by the spherical crowns of the solder balls. |
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