PKC-136

3/5

1.E-01

1.E+00

1.E+01

1.E+02

1.E-04

1.E-03

1.E-02

1.E-01

1.E+00

1.E+01

tp(ms)

Tj initial=25°C

Pp(kW)

Fig. 1: Peak pulse power versus exponential pulse

duration.

0

10

20

30

40

50

60

70

80

90

100

110

0

25

50

75

100

125

150

175

Tj(°C)

%

Fig. 2: Relative variation of peak pulse power

versus initial junction temperature.

Symbol

Parameter

Value

Unit

Junction to leads

L = 10mm

40

°C/W

Junction to ambiant condition see note 1

105

°C/W

Note 1: Device mounted on a epoxy FR4 board of 35µm thickness

Lead Length: 10mm

Pad diameter: 4mm

Track width: 1mm

Track length: 25mm

S(Cu) = 1.5cm

S(Cu) = 3.5cm

THERMAL RESISTANCES

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

0

25

50

75

100

125

150

Tamb(°C)

Tamb =Tleads

Printed circuit board

P(W)

Fig. 3: Average power dissipation versus ambient

temperature.

1.0

10.0

100.0

1000.0

1.E-02

1.E-01

1.E+00

1.E+01

1.E+02

1.E+03

Zth(j-a) (°C/W)

Free air

tp(s)

Fig. 4: Variation of thermal impedance junction to

ambient versus pulse duration (printed circuit

board epoxy FR4)