FC30

Package information

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Package information

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a lead-free second level interconnect. The category of

second Level Interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an ST trademark.

ECOPACK specifications are available at: www.st.com.

Figure 7.

LGA 14: mechanical data and package dimensions

OUTLINE AND

MECHANICAL DATA

DIM.

mm

inch

MIN.

TYP.

MAX.

MIN.

TYP.

MAX.

A1

0.920

1.000

0.0362 0.0394

A2

0.700

0.0275

A3

0.180

0.220

0.260 0.0071 0.0087 0.0102

D1

2.850

3.000

3.150 0.1122 0.1181 0.1240

E1

4.850

5.000

5.150 0.1909 0.1968 0.2027

e

0.800

0.0315

d

0.300

0.0118

L1

4.000

0.1575

N

1.360

0.0535

N1

1.200

0.0472

P1

0.965

0.975

0.985 0.0380 0.0384 0.0386

P2

0.640

0.650

0.660 0.0252 0.0256 0.0260

T1

0.750

0.800

0.850 0.0295 0.0315 0.0335

T2

0.450

0.500

0.550 0.0177 0.0197 0.0217

R

1.200

1.600 0.0472

0.0630

h

0.150

0.0059

k

0.050

0.0020

i

0.100

0.0039

s

0.100

0.0039

LGA14 (3x5x0.92mm) Pitch 0.8mm

Land Grid Array Package

7773587 C