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STB60NF06L 数据表(PDF) 3 Page - STMicroelectronics |
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STB60NF06L 数据表(HTML) 3 Page - STMicroelectronics |
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3 / 16 page ![]() STB60NF06L - STP60NF06L - STP60NF06LFP Electrical ratings 3/16 1 Electrical ratings Table 1. Absolute maximum ratings Symbol Parameter Value Unit D2PAK TO-220 TO-220FP VDS Drain-source voltage (VGS = 0) 60 V VDGR Drain-gate voltage (RGS = 20 kΩ)60 V VGS Gate- source voltage ± 15 V ID Drain current (continuous) at TC = 25°C 60 60(1) 1. Refer to SOA for the max allowable current values on FP-type due to Rth value A ID Drain current (continuous) at TC = 100°C 42 42(1) A IDM (2) 2. Pulse width limited by safe operating area. Drain current (pulsed) 240 240(1) A Ptot Total dissipation at TC = 25°C 110 30 W Derating Factor 0.73 0.2 W/°C dv/dt (3) 3. ISD ≤60A, di/dt ≤600A/µs, VDD ≤48V, Tj ≤TJMAX Peak diode recovery voltage slope 20 V/ns EAS (4) 4. Starting Tj = 25 °C, ID = 30A, VDD = 30V Single pulse avalanche energy 320 mJ VISO Insulation withstand voltage (DC) -- 2000 V Tstg Storage temperature -65 to 175 °C Tj Max. operating junction temperature Table 2. Thermal data D2PAK TO-220 TO-220FP Rthj-case Thermal resistance junction-case Max 1.36 5.0 °C/W Rthj-amb Rthj-pcb Tl Thermal resistance junction-ambient Thermal resistance junction-pcb(1) Maximum lead temperature for soldering purpose 1. Only for SMD, When mounted on 1 inch2 FR-4 board, 2 oz of Cu. Max Max 62.5 35 300 °C/W °C/W °C |
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