LSG T67K

DATASHEET

DATASHEET

13 | Version 1.2 | 2024-11-21

Recommended Solder Pad 9)

OHLPY439

Padgeometrie für

verbesserte Wärmeableitung

improved heat dissipation

Paddesign for

Lötstoplack

Solder resist

1.1 (0.043)

2.6 (0.102)

3.3 (0.130)

0.4 (0.016)

Cathode marking

Kathoden Markierung /

Cu Fläche / 12 mm per pad

2

Cu-area

_

<

3.3 (0.130)

For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere. Package not

suitable for ultra sonic cleaning.