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ISO7221ADRG4 数据表(PDF) 13 Page - Texas Instruments |
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ISO7221ADRG4 数据表(HTML) 13 Page - Texas Instruments |
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13 / 26 page ![]() DEVICE I/O SCHEMATICS OUT 8 W 13 W IN 750kW 500 W Input Output VCC1 VCC1 VCC1 VCC2 IEC SAFETY LIMITING VALUES ISO7220A, ISO7220B, ISO7220C, ISO7220M ISO7221A, ISO7221B, ISO7221C, ISO7221M www.ti.com ................................................................................................................................................................ SLLS755H – JULY 2006 – REVISED MAY 2008 Safety limiting intends to prevent potential damage to the isolation barrier upon failure of input or output circuitry. A failure of the IO can allow low resistance to ground or the supply and, without current limiting, dissipate sufficient power to overheat the die and damage the isolation barrier potentially leading to secondary system failures. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT θ JA = 212°C/W, VI = 5.5 V, TJ = 170°C, TA = 25°C 124 Safety input, output, or IS SOIC-8 mA supply current θ JA = 212°C/W, VI = 3.6 V, TJ = 170°C, TA = 25°C 190 TS Maximum case temperature SOIC-8 150 °C The safety-limiting constraint is the absolute maximum junction temperature specified in the absolute maximum ratings table. The power dissipation and junction-to-air thermal impedance of the device installed in the application hardware determines the junction temperature. The assumed junction-to-air thermal resistance in the Thermal Characteristics table is that of a device installed in the JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages and is conservative. The power is the recommended maximum input voltage times the current. The junction temperature is then the ambient temperature plus the power times the junction-to-air thermal resistance. Copyright © 2006–2008, Texas Instruments Incorporated Submit Documentation Feedback 13 Product Folder Link(s): ISO7220A ISO7220B ISO7220C ISO7220M ISO7221A ISO7221B ISO7221C ISO7221M |
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