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VBWFD2 数据表(PDF) 11 Page - Midas Components

部件名 VBWFD2
功能描述  OLED Module
PDF  15 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
制造商  MIDASDISPLAYS [Midas Components]
网页  https://midasdisplays.com/
标志 MIDASDISPLAYS - Midas Components

VBWFD2 数据表(HTML) 11 Page - Midas Components

Back Button VBWFD2 Datasheet HTML 7Page - Midas Components VBWFD2 Datasheet HTML 8Page - Midas Components VBWFD2 Datasheet HTML 9Page - Midas Components VBWFD2 Datasheet HTML 10Page - Midas Components VBWFD2 Datasheet HTML 11Page - Midas Components VBWFD2 Datasheet HTML 12Page - Midas Components VBWFD2 Datasheet HTML 13Page - Midas Components VBWFD2 Datasheet HTML 14Page - Midas Components VBWFD2 Datasheet HTML 15Page - Midas Components  
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NO
Item
Criterion
AQL
07
Cracked
glass
The OLED with extensive crack is not acceptable.
2.5
08
Backlight
elements
8.1 Illumination source flickers when lit.
8.2 Spots or scratched that appear when lit must be judged.
Using OLED spot, lines and contamination standards.
8.3 Backlight doesn’t light or color wrong.
0.65
2.5
0.65
09
Bezel
9.1 Bezel may not have rust, be deformed or have
fingerprints, stains or other contamination.
9.2 Bezel must comply with job specifications.
2.5
0.65
10
PCB、COB
10.1 COB seal may not have pinholes larger than 0.2mm or
contamination.
10.2 COB seal surface may not have pinholes through to the
IC.
10.3 The height of the COB should not exceed the height
indicated in the assembly diagram.
10.4 There may not be more than 2mm of sealant outside the
seal area on the PCB. And there should be no more than
three places.
10.5 No oxidation or contamination PCB terminals.
10.6 Parts on PCB must be the same as on the production
characteristic chart. There should be no wrong parts,
missing parts or excess parts.
10.7 The jumper on the PCB should conform to the product
characteristic chart.
10.8 If solder gets on bezel tab pads, OLED pad, zebra pad
or screw hold pad, make sure it is smoothed down.
2.5
2.5
0.65
2.5
2.5
0.65
0.65
2.5
11
Soldering
11.1 No un-melted solder paste may be present on the PCB.
11.2 No cold solder joints, missing solder connections,
oxidation or icicle.
11.3 No residue or solder balls on PCB.
11.4 No short circuits in components on PCB.
2.5
2.5
2.5
0.65



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