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20220309

(6/10)

notch-filter_commercial_avrf_en.fm

EMC Components

AVRF series

Attention on a circuit board design

Arrangements of components

(1) I was based on camber of substrate and suggested protocol of

products arrangement, as stress does not join to the utmost is

shown in following.

(2) In payment near by board, depending on mount position of

products, as mechanical stress varies, please refer to the following

diagram.

The order of A > B = C > D > E eases the stress.

Substrate for flexural stress

Adverse events

Substrate for flexural stress

Good example

Direction of

surface solder

Solder the mountain fold as a

top.

Solder the mountain fold as a

bottom. [Please review the

italicized portion, as I am

unsure what you mean to con-

vey here.]

Chip

arrangements

(direction)

Mounted vertically to the per-

foration and slit.

Mounted horizontally to the

perforation and slit.

Distance from

perforation

and slit

portion

Close location is disadvanta-

geous of perforation and slit.

It is an advantage so distant

location away places the perfo-

ration and slit.

Perforation or slit

Perforation or slit

Perforation or slit

Perforation or slit

L1

(L1<L2)

L2

(L1<L2)

B

E

D

A

C

Slit

Perforation