| 数据搜索系统,热门电子元器件搜索 |
|
ADRF5715BCCZN-R7 数据表(PDF) 6 Page - Analog Devices |
|
|
|||||||||||||||||||||||||||||
ADRF5715BCCZN-R7 数据表(HTML) 6 Page - Analog Devices |
|
6 / 14 page ![]() Data Sheet ADRF5715 ABSOLUTE MAXIMUM RATINGS analog.com Rev. 0 | 6 of 14 For recommended operating conditions, see Table 1 and Table 2. Table 3. Absolute Maximum Ratings Parameter Rating VDD −0.3 V to +3.6 V VSS −3.6 V to +0.3 V Digital Control Inputs Voltage −0.3 V to VDD + 0.3 V Current 3 mA RF Input Power1 Dual Supply (VDD = +3.3 V, VSS = −3.3 V, f = 100 MHz to 30 GHz, TCASE = 85°C2) Average 31 dBm Peak 34 dBm Hot Switching Average 28 dBm Hot Switching Peak 31 dBm Single Supply (VDD = 3.3 V, VSS = 0 V, f = 100 MHz to 30 GHz, TCASE = 85°C2) Average 19 dBm Peak 19 dBm Hot Switching Average 19 dBm Hot Switching Peak 19 dBm Unbiased Condition (VDD and VSS = 0 V) 14 dBm Temperature Junction (TJ) 135°C Storage Range −65°C to +150°C Reflow 260°C 1 For power derating over frequency, see Figure 2 and Figure 3. Applicable for all ATTIN and ATTOUT power specifications. 2 For 105°C operation, the power handling degrades from the TCASE = 85°C specification by 3 dB. Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operat- ing conditions for extended periods may affect product reliability. THERMAL RESISTANCE Thermal performance is directly linked to printed circuit board (PCB) design and operating environment. Careful attention to PCB thermal design is required. θJC is the junction to case bottom (channel to package bottom) thermal resistance. Table 4. Thermal Resistance Package Type θJC1 Unit CC-12-6 50 °C/W 1 θJC was determined by simulation under the following conditions: the heat transfer is due solely to thermal conduction from the channel through the round pad to the PCB, and the ground pad is held constant at the operating temperature of 85°C. POWER DERATING CURVES Figure 2. Power Derating vs. Frequency, Low Frequency Detail, TCASE = 85°C Figure 3. Power Derating vs. Frequency, High Frequency Detail, TCASE = 85°C |
|
|
链接网址 |
| ALLDATASHEET是否为您带来帮助? [ DONATE ] |
关于 Alldatasheet | 广告服务 | 联系我们 | 隐私政策 | 数据表链接 | 链接交换 | 制造商名单 All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |