0.001

0.010

0.100

1.000

0

1

2

3

4

5

6

7

8

9

10

t(s)

IM(A)

Ta=25°C

Ta=50°C

Ta=100°C

t

δ=0.5

Fig. 3: Non repetitive surge peak forward current

versus overload duration; device mounted on printed

circuit board S(Cu)=1cm2 (maximum values).

1.0E-2

1.0E-1

1.0E+0

1.0E+1

1.0E+2

1.0E+3

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

tp

Zth(j-a)/Rth(j-a)

δ = 0.1

δ = 0.2

δ = 0.5

Single pulse

Printed circuit board: SCu=1cm² (e=35

µm)

T

tp

Fig. 4: Relative variation of thermal impedance

junction to ambient versus pulse duration.

0.0

1.0

2.0

3.0

4.0

5.0

20

30

40

50

60

70

80

90

100

S(Cu) (cm²)

Rth(j-a) (°C/W)

P=1.5W Printed circuit board epoxy (Cu thickness:35

µm)

Fig. 5: Variation of thermal resistance junction to

ambient versus copper surface under each lead.

0

1020

304050

607080

90

100

1.0E-1

1.0E+0

1.0E+1

1.0E+2

1.0E+3

VR(V)

IR(µA)

Tj=100°C

Tj=25°C

Tj=75°C

Fig. 6: Reverse leakage current versus reverse

voltage applied (typical values).

®

STPS1100U

3/5