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ESDALC6V1PX 数据表(PDF) 5 Page - STMicroelectronics |
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ESDALC6V1PX 数据表(HTML) 5 Page - STMicroelectronics |
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5 / 9 page ![]() ESDALC6V1Px Package information 5/9 3 Package information ● Epoxy meets UL94, V0 In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at www.st.com. Figure 14. SOT-663 footprint (dimensions in mm) Table 3. SOT-663 dimensions Ref. Dimensions Millimeters Inches Min. Typ. Max. Min. Typ. Max. A 0.60 0.70 0.80 0.024 0.028 0.031 D 1.40 1.60 1.80 0.055 0.063 0.071 E 0.75 0.85 0.95 0.030 0.033 0.037 HE 1.50 1.60 1.70 0.059 0.063 0.067 L 0.39 0.015 L2 0.40 0.47 0.50 0.016 0.018 0.020 c 0.08 0.13 0.18 0.003 0.005 0.007 b 0.22 0.27 0.37 0.009 0.011 0.015 e 0.50 0.020 2xe 0.90 1.00 1.10 0.035 0.040 0.043 α 4° 7° 4° 7° D A b HE E L e 2xe L2 alpha c |
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