CAT3604

9

Doc. No. MD-5008 Rev. J

Characteristics subject to change without notice

TYPICAL CHARACTERISTICS

RECOMMENDED LAYOUT

When the driver is in the 1.5x charge pump mode, the

1MHz switching frequency operation requires to

minimize trace length and impedance to ground on all

4 capacitors. A ground plane should cover the area on

the bottom side of the PCB opposite to the IC and the

bypass capacitors. Capacitors Cin and Cout require

short connection to ground which can be done with

multiple vias as shown on Figure 2. A square copper

area matches the QFN16 exposed pad (GND) which

is connected by a trace to the pin 12 pad (GND). A

large via (metalized hole) centered in the square pad

provides a low impedance connection to the ground

plane on the opposite side of the PCB and allows the

heat dissipated by the driver IC to spread out resulting

in excellent thermal performance.

Figure 2. PCB Layout

Figure 3. Recommended QFN 16 Package

Land Pattern

Foldback Current Limiting

0

1

2

3

4

5

0

100

200

300

400

500

OUTPUT CURRENT [mA]

1x mode

2.25mm

0.35mm

0.65mm