© 2006 CTS Corporation. All rights reserved. Information subject to change

CTS Electronic Components

Page 2

April 08

www.ctscorp.com

VME64 & VME64x Terminators

Complete ClearONE Product, Processing, and Application Information can be found at the following link:

http://www.ctscorp.com/components/clearone.asp

Recommended Land Pattern

1.00 mm Pitch (B7) = 0.51mm/.020 inch

Outline of Substrate

PCB Pad Diameter

For .006" Thick Solder Paste Stencil, Aperture Opening

Should be Equal to the PCB Pad Diameter.

additional PCB design information

Blind vias to ground

reference pla ne layer

recomme nded o n

every oth er row as

shown.

Blind vias to V

CC

reference pla ne layer

recomme nded o n

every oth er row as

shown.

Blind vias to ground

reference plane layer

recommended on

every other row as

shown.

Vias to Vcc

Termination Island

Solder mask is

used to define

the ball pads.

BGA Routing Schemes

Option A

Option B

Solder Mask Dia = Pad

Diameter +.15mm (.006 inch)

Mechanical Diagram

K

P (Pitch)

L

W

H

P (Pitch)

A1 Identifier

RT_2__B7

CTS YRWK

D

1.0mm Pitch

L

W

H

P

D

K

mm

8.00

±0.15

3.00

±0.15

1.19

±0.15

1.00

±0.25

0.64

±0.05

0.50

±0.25

RT1210B7

RT1211B7

RT2210B7

RT2211B7

inch

.315

±.006

.118

±.006

.047

±.006

.039

±.010

.025

±.002

.020

±.010