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STB160NF03L 数据表(PDF) 3 Page - STMicroelectronics |
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STB160NF03L 数据表(HTML) 3 Page - STMicroelectronics |
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3 / 9 page ![]() 3/9 STB160NF03L Safe Operating Area ELECTRICAL CHARACTERISTICS (CONTINUED) SWITCHING ON SWITCHING OFF SOURCE DRAIN DIODE Note: 1. Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %. 2. Pulse width limited by safe operating area. Symbol Parameter Test Conditions Min. Typ. Max. Unit td(on) Turn-on Delay Time VDD = 15V, ID = 80A RG = 4.7Ω VGS = 10V (see test circuit, Figure 3) 28 ns tr Rise Time 285 ns Qg Qgs Qgd Total Gate Charge Gate-Source Charge Gate-Drain Charge VDD = 24V, ID = 160A, VGS = 10V 123 21 40 nC nC nC Symbol Parameter Test Conditions Min. Typ. Max. Unit td(off) tf Turn-off-Delay Time Fall Time VDD = 15V, ID = 80A, RG =4.7Ω, VGS = 10V (see test circuit, Figure 5) 110 65 ns ns td(off) tf tc Off-voltage Rise Time Fall Time Cross-over Time Vclamp =24V, ID =40A RG =4.7Ω, VGS = 10V 110 35 70 ns ns ns Symbol Parameter Test Conditions Min. Typ. Max. Unit ISD Source-drain Current 160 A ISDM (1) Source-drain Current (pulsed) 640 A VSD (2) Forward On Voltage ISD = 160A, VGS = 0 1.3 V trr Qrr IRRM Reverse Recovery Time Reverse Recovery Charge Reverse Recovery Current ISD = 80A, di/dt = 100A/µs, VDD = 15V, Tj = 25°C (see test circuit, Figure 5) 80 180 4.5 ns nC A Thermal Impedance |
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