STDD15 series

3/6

1.E-01

1.E+00

1.E+01

1.E+02

0.0

0.2

0.4

0.6

0.8

1.0

1.2

VFM(V)

Tj=125°C

Tj=125°C

Tj=85°C

Tj=85°C

Tj=25°C

Tj=25°C

Tj=-40°C

Tj=-40°C

IFM(mA)

Fig. 1:

Forward voltage drop versus forward

current (typical values).

1.E-03

1.E-02

1.E-01

1.E+00

1.E+01

1.E+02

0.0

2.5

5.0

7.5

10.0

12.5

15.0

VR(V)

Tj=125°C

Tj=85°C

Tj=25°C

IR(µA)

Fig. 2: Reverse leakage current versus reverse

voltage applied (typical values).

1

10

100

1.0

10.0

100.0

IF(mA)

F=10kHz

Tj=25°C

RF( )

Ω

Fig. 3:

Differential forward resistance versus

forward current (typical values).

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

0.0

2.5

5.0

7.5

10.0

12.5

15.0

VR(V)

F=1MHz

Vosc=30mV

RMS

Tj=25°C

C(pF)

Fig. 4:

Junction capacitance versus reverse

voltage applied (typical values).

10.0

100.0

1000.0

1.E-02

1.E-01

1.E+00

1.E+01

1.E+02

tp(s)

Zth(j-a)(°C/W)

Fig. 5: Variation of thermal impedance junction to

ambient versus pulse duration (printed circuit

board, epoxy FR4).

300

350

400

450

500

550

600

0

5

10

15

20

25

30

35

40

45

50

S(mm²)

Rth(j-a)

Fig. 6: Thermal resistance junction to ambient

versus copper surface under each lead (printed

circuit board, epoxy FR4)..