Thermal characteristics

L6374

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4

Thermal characteristics

4.1

The reference point is the knee on the four central pins, where the pins are upwardly bent

and the soldering joint with the PCB footprint can be made.

4.2

If a dissipating surface, thick at least 35

µm, and with a surface similar or bigger than the

one shown, is created making use of the printed circuit. Such heatsinking surface is

considered on the bottom side of an horizontal PCB (worst case).

4.3

If the power dissipating pins (the four central ones), as well as the others, have a minimum

thermal connection with the external world (very thin strips only) so that the dissipation

takes place through still air and through the PCB itself.

It is the same situation of point above, without any heatsinking surface created on purpose

on the board.

Table 4.

Thermal data

Symbol

Parameter

Value

Unit

Thermal resistance, junction to pin

17

°C/W

Thermal resistance, junction to ambient

(see thermal characteristics)

65

°C/W

Thermal resistance, junction to ambient

(see thermal characteristics)

80

°C/W