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BAT30 数据表(PDF) 2 Page - STMicroelectronics |
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BAT30 数据表(HTML) 2 Page - STMicroelectronics |
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2 / 12 page ![]() Characteristics BAT30 Series 2/12 1 Characteristics Table 1. Absolute ratings (limiting values at Tj = 25° C, unless otherwise specified) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 30 V IF Continuous forward current 300 mA IFSM Surge non repetitive forward current tp = 10 ms Sinusoidal 1 A Tstg Storage temperature range -65 to +150 ° C Tj Maximum operating junction temperature(1) 150 ° C TL Maximum soldering temperature 260 ° C 1. Pulse test: tp = 5 ms, δ < 2 % Table 2. Thermal parameters Symbol Parameter Value Unit Rth(j-a) Junction to ambient(1) SOT-23 500 ° C/W SOT-323, SOD-323, 550 SOD-523, SOT-666 600 1. On epoxy printed circuit board with recommended pad layout Table 3. Static electrical characteristics Symbol Parameter Test conditions Min. Typ Max. Unit IR (1) Reverse leakage current Tj = 25° C VR = 5 V 0.5 µA VR = 10 V 1 VR = 25 V 0.65 3 VR = 30 V 5 Tj = 70° C VR = 10 V 720 Tj = 85° C 18 50 VF (2) Forward voltage drop Tj = 25° C IF = 0.1 mA 240 mV IF = 1 mA 300 IF = 10 mA 375 IF = 30 mA 430 IF = 100 mA 500 IF = 200 mA 580 IF = 300 mA 530 1. Pulse test: tp = 5 ms, δ < 2 % 2. Pulse test: tp = 380 µs, δ < 2 % |
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