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STTH806D 数据表(PDF) 4 Page - STMicroelectronics |
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STTH806D 数据表(HTML) 4 Page - STMicroelectronics |
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4 / 9 page ![]() Characteristics STTH806 4/9 Figure 7. Softness factor versus dIF/dt (typical values) Figure 8. Relative variations of dynamic parameters versus junction temperature 0.00 0.20 0.40 0.60 0.80 1.00 1.20 1.40 1.60 1.80 2.00 0 50 100 150 200 250 300 350 400 450 500 S factor I 2 x I T = 125° C F F(AV) j ≤ V = 400 V R dI /dt(A/µs) F 0.00 0.25 0.50 0.75 1.00 1.25 1.50 1.75 2.00 2.25 2.50 25 50 75 100 125 IRM QRR S factor T (°C) j I=I Reference: T =125°C F F(AV) j V =400V R Figure 9. Transient peak forward voltage versus dIF/dt (typical values) Figure 10. Forward recovery time versus dIF/dt (typical values) 0 2 4 6 8 10 12 14 0 100 200 300 400 500 V (V) FP dI /dt(A/µs) F I=I T =125°C F F(AV) j 0 20 40 60 80 100 120 140 160 180 200 0 100 200 300 400 500 t (ns) fr dI /dt(A/µs) F I=I T =125°C F F(AV) j V =1.1 x V max. FR F Figure 11. Junction capacitance versus reverse voltage applied (typical values) Figure 12. Thermal resistance junction to ambient versus copper surface under tab (printed circuit board FR4, eCU = 35 µm) 1 10 100 1 10 100 1000 C(pF) V (V) R F=1MHz V =30mV T =25°C OSC RMS j 0 10 20 30 40 50 60 70 80 0 5 10 15 20 25 30 35 40 R (°C/W) th(j-a) S (cm²) (Cu) D²PAK |
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