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ST8024 数据表(PDF) 8 Page - STMicroelectronics |
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ST8024 数据表(HTML) 8 Page - STMicroelectronics |
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8 / 31 page ![]() Maximum ratings ST8024 8/31 3 Maximum ratings Note: Absolute maximum ratings are those values beyond which damage to the device may occur. Functional operation under these conditions is not implied. Table 3. Absolute maximum ratings Symbol Parameter Min. Max. Unit VDD, VDDP Supply voltage -0.3 7 V Vn1 Voltage on pins XTAL1, XTAL2, 5V/3V, RSTIN, AUX2UC, AUX1UC, I/OUC, CLKDIV1, CLKDIV2, PORADJ, CMDVCC, PRES, PRES and OFF -0.3 VDD + 0.3 V Vn2 Voltage on card contact pins I/O, RST, AUX1, AUX2 and CLK -0.3 VCC + 0.3 V Vn3 Voltage on pins VUP, S1 and S2 7 V ESD1 MIL-STD-883 class 3 on card contact pins, PRES and PRES (1) (2) 1. All card contacts are protected against any short with any other card contact 2. Method 3015 (HBM, 1500 Ω, 100 pF) 3 positive pulses and 3 negative pulses on each pin referenced to ground. -6 6 kV ESD2 MIL-STD-883 class 2 on µC contact pins and RSTIN (1) (2) -2 2 kV TJ(MAX) Maximum operating junction temperature 150 °C TSTG Storage temperature range -40 150 °C Table 4. Thermal data Symbol Parameter Condition SO-28 TSSOP28 Unit RthJA Thermal resistance junction-ambient temperature Multilayer test board (Jedec standard) 56 50 °K/W Table 5. Recommended operating conditions Symbol Parameter Test conditions Min. Typ. Max. Unit TA Temperature range -25 85 °C |
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