STTH2003C

Package information

9/11

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a Lead-free second level interconnect . The category of

second level interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an ST trademark.

ECOPACK specifications are available at: www.st.com.

Table 8.

TO-220FPAB

dimensions

Ref.

Dimensions

Millimeters

Inches

Min.

Max.

Min.

Max.

A

4.4

4.6

0.173

0.181

B

2.5

2.7

0.098

0.106

D

2.5

2.75

0.098

0.108

E

0.45

0.70

0.018

0.027

F

0.75

1

0.030

0.039

F1

1.15

1.70

0.045

0.067

F2

1.15

1.70

0.045

0.067

G

4.95

5.20

0.195

0.205

G1

2.4

2.7

0.094

0.106

H

10

10.4

0.393

0.409

L2

16 Typ.

0.63 Typ.

L3

28.6

30.6

1.126

1.205

L4

9.8

10.6

0.386

0.417

L5

2.9

3.6

0.114

0.142

L6

15.9

16.4

0.626

0.646

L7

9.00

9.30

0.354

0.366

Dia.

3.00

3.20

0.118

0.126

H

A

B

Dia

L7

L6

L5

F1

F2

F

D

E

L4

G1

G

L2

L3