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STTH3L06 数据表(PDF) 5 Page - STMicroelectronics |
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STTH3L06 数据表(HTML) 5 Page - STMicroelectronics |
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5 / 10 page ![]() STTH3L06 5/10 Figure 13: Thermal resistance junction to ambient versus copper surface under lead (epoxy FR4, eCU=35µm) (SMB / SMC) Figure 14: Thermal resistance junction to ambient versus copper surface under tab (epoxy FR4, eCU=35µm) (DPAK) Figure 15: Thermal resistance versus lead length 0 10 20 30 40 50 60 70 80 90 100 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 R (°C/W) th(j-a) S (cm²) CU SMB SMC 0 10 20 30 40 50 60 70 80 90 100 0 5 10 15 20 25 30 35 40 R (°C/W) th(j-a) S (cm²) CU DPAK 0 10 20 30 40 50 60 70 80 90 100 5 1015 2025 R (°C/W) th L (mm) lead Rth(j-a) Rth(j-l) DO-201AD |
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