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STLA01 数据表(PDF) 8 Page - STMicroelectronics

部件名 STLA01
功能描述  50 mA stand-alone linear LED driver
PDF  16 Pages
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制造商  STMICROELECTRONICS [STMicroelectronics]
网页  http://www.st.com
标志 STMICROELECTRONICS - STMicroelectronics

STLA01 数据表(HTML) 8 Page - STMicroelectronics

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Application information
STLA01
8/16
6
Application information
The STLA01 is a single LED driver using a constant-current topology. It can deliver up to 80
mA of output current.
If a 1% program resistor is connect from the PROG pin to the GND pin and the EN pin is
higher than 0.92 V, the device will supply the LED with the programmed constant current.
Putting the EN pin below 0.80 V results in no current flow into the LED diode.
6.1
VCC pin
A positive input supply voltage provides power to the driver. VCC can range from 3.75 V to 6
V and should be bypassed with at least a 1 µF capacitor. In shutdown mode, the ILED = 0.
6.2
EN pin
The enable input pin is used to shut down the device when the value of the pin is below
0.80 V. In shutdown condition, the device has less than 10 µA supply current. The enable pin
has an internal pull down (REN).
If unused, the pin should be tied to VCC.
6.3
Programming charge current
The LED current is programmed using a single resistor from the PROG pin to ground. The
LED current is 100 times the current out of the PROG pin. The program resistor and the led
current are calculated using, in first approximation, the following equations:
RPROG = 100 x (1.22 V / ILED)
6.4
Power dissipation
A good thermal PCB layout is very important to maximize the available output current. The
thermal path for the heat generated by the IC is from the die to the copper lead frame
through the package leads and exposed pad to the PC board copper. The PC board copper
acts as the heat sink. The copper pad footprints should be as wide as possible and expand
to larger copper areas in order to spread and dissipate the heat to the surrounding ambient.
Feed-through vias to inner or backside copper layers are also useful in improving the overall
thermal performance of the device. Other heat sources on the board, not related to the
device, must also be considered when designing a PC board layout because they will affect
overall temperature rise and the maximum output current.



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