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USB6B1 数据表(PDF) 8 Page - STMicroelectronics |
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USB6B1 数据表(HTML) 8 Page - STMicroelectronics |
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8 / 9 page ![]() Ordering information USB6B1 8/9 Figure 10. SO-8 footprint (dimensions in mm) In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 6 Ordering information 7 Revision history 6.8 4.2 1.27 0.6 Ordering code Marking Package Weight Base qty Delivery mode USB6B1 USB62 SO-8 0.077 g 100 Tube USB6B1RL USB62 2500 Tape and reel Date Revision Description of Changes Oct-2003 6A Previous issue. 03-May-2005 7 Figure 1 on page 1: dots connection corrected. 22-Feb-2006 8 Marking typing error corrected on page 1 and 7. 16-Aug-2006 9 Reformated to current standard. ECOPACK statement added. SO-8 package dimensions corrected. |
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