STM1061

Package Mechanical

17/23

7

Package Mechanical

packages. These packages have a Lead-free second level interconnect. The category of

second Level Interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97.

The maximum ratings related to soldering conditions are also marked on the inner box label.

ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.

Figure 17.

SOT23-3 – 3-lead Small Outline Transistor Package Outline

1.

Drawing is not to scale.

SOT23-3

0.10 C

A

A2

A1

3X

C

C

L1

θ

L

C

e1

D

e

3X b

E

M

0.15

CA B

B

E1

A

M

0.20

C A B

1