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STN3NF06 数据表(PDF) 2 Page - STMicroelectronics |
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STN3NF06 数据表(HTML) 2 Page - STMicroelectronics |
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2 / 8 page ![]() STN3NF06 2/8 Note: 1. THERMAL DATA (*) When Mounted on FR-4 board with 1 inch2 pad, 2 oz of Cu and t [ 10 sec (**) When Mounted on minimum recommended footprint ELECTRICAL CHARACTERISTICS (Tcase = 25 °C unless otherwise specified) OFF ON (1) DYNAMIC Rthj-pcb Rthj-pcb Tl Thermal Resistance Junction-PCB (*) Thermal Resistance Junction-PCB (**) Maximum Lead Temperature For Soldering Purpose (for 10 sec. 1.6 mm from case) Max Max Typ 38 100 260 °C/W °C/W °C Symbol Parameter Test Conditions Min. Typ. Max. Unit V(BR)DSS Drain-source Breakdown Voltage ID = 250 µA, VGS = 0 60 V IDSS Zero Gate Voltage Drain Current (VGS = 0) VDS = Max Rating VDS = Max Rating TC = 125°C 1 10 µA µA IGSS Gate-body Leakage Current (VDS = 0) VGS = ± 20V ±100 nA Symbol Parameter Test Conditions Min. Typ. Max. Unit VGS(th) Gate Threshold Voltage VDS = VGS ID = 250 µA 23 4 V RDS(on) Static Drain-source On Resistance VGS = 10 V ID = 1.5 A 0.07 0.10 Ω Symbol Parameter Test Conditions Min. Typ. Max. Unit gfs (*) Forward Transconductance VDS = 15 V ID = 1.5A 3S Ciss Coss Crss Input Capacitance Output Capacitance Reverse Transfer Capacitance VDS = 25V, f = 1 MHz, VGS = 0 315 70 30 pF pF pF |
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