Package mechanical data

STM6717/6718/6719/6720/STM6777/6778/6779/6780

22/29

6

Package mechanical data

packages. These packages have a lead-free second level interconnect. The category of

second Level Interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97.

The maximum ratings related to soldering conditions are also marked on the inner box label.

ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.

Figure 28.

SOT23-5 – 5-lead small outline transistor package mechanical drawing

Note:

Drawing is not to scale.

SOT23-5b

C 0.10

A

A2

A1

5x

C

D

e1

e

E

A

M

CA B

5x b

0.20

1

B

E1

C

L

θ

Datum A

0.20