STTS75

List of figures

5/39

List of figures

Figure 1.

Logic diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Figure 2.

Connections (SO8, TSSOP8) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Figure 3.

Functional block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Figure 4.

Typical 2-wire interface connection diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Figure 5.

OS output temperature response diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Figure 6.

Serial bus data transfer sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

Figure 7.

Acknowledgement sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

Figure 8.

Slave address location . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

Figure 9.

Figure 10.

Typical pointer set followed by an immediate READ for 2-byte register (e.g. temp). . . . . . 25

Figure 11.

Typical 1-byte READ from the configuration register with preset pointer . . . . . . . . . . . . . . 25

Figure 12.

Typical pointer set followed by an immediate READ from the configuration register . . . . . 26

Figure 13.

Configuration register WRITE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

Figure 14.

Figure 15.

Temperature variation vs. voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

Figure 16.

Bus timing requirements sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

Figure 17.

SO8 – 8-lead plastic small package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

Figure 18.

MSOP8 (TSSOP8) – 8-lead, thin shrink small package (3mm x 3mm) outline. . . . . . . . . . 35

Figure 19.

Device topside marking information (SO8) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37

Figure 20.

Device topside marking information (MSOP8/TSSOP8). . . . . . . . . . . . . . . . . . . . . . . . . . . 37