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TPN3021 数据表(PDF) 6 Page - STMicroelectronics |
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TPN3021 数据表(HTML) 6 Page - STMicroelectronics |
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6 / 8 page ![]() Package mechanical data TPN3021 6/8 Rev 4 3 Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Table 6. SO-8 (Plastic) dimensions REF. DIMENSIONS Millimetres Inches Min. Typ. Max. Min. Typ. Max. A 1.75 0.069 a1 0.1 0.25 0.004 0.010 a2 1.65 0.065 b 0.35 0.48 0.014 0.019 b1 0.19 0.25 0.007 0.010 C 0.50 0.020 c1 45° (typ) D 4.8 5.0 0.189 0.197 E 5.8 6.2 0.228 0.244 e 1.27 0.050 e3 3.81 0.150 F 3.8 4.0 0.15 0.157 L 0.4 1.27 0.016 0.050 M0.6 0.024 S 8° (max) |
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