ESDA18-1F2

Ordering information scheme

5/8

3

Ordering information scheme

Figure 10.

Ordering information scheme

4

Packing information

packages. These packages have a lead-free second level interconnect. The category of

second level interconnect is marked on the inner box label, in compliance with JEDEC

Standard JESD97. The maximum ratings related to soldering conditions are also marked on

the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at

www.st.com.

Figure 11.

Flip Chip package dimensions

ESDA

18 - 1

Fx

ESD Array

Number of line

Package

Breakdown Voltage

18 = 18 Volts max.

1 = signle line

F = Flip Chip

x = 2: Lead-free, pitch = 500 µm, bump = 315 µm

0.92 mm ± 30 µm

315 µm ± 50

500 µm ± 50

225 µm

650 µm ± 65