EMIF02-AV01F3

Ordering information

5/7

Figure 13.

Flip Chip tape and reel specification

Note:

Note: More information is available in the application note:

AN2348:"Flip Chip: Package description and recommendations for use"

AN1751: “EMI filters: Recommendations and measurements”

4

Ordering information

Figure 11.

Footprint

Figure 12.

Marking

220 µm recommended

220 µm recommended

260 µm maximum

Solder stencil opening:

Copper pad Diameter:

Solder mask opening:

300 µm minimum

x

y

x

w

z

w

Dot

xx = marking

yww = datecode

(y = year

ww = week)

z = manufacturing location

E

Dot identifying Pin A1 location

User direction of unreeling

All dimensions in mm

4 ± 0.1

1.01

4 ± 0.1

Ø 1.5 ± 0.1

0.71 ± 0.05

Table 3.

Ordering information

Order code

Marking

Package

Weight

Base qty

Delivery mode

EIMF02-AV01F3

HH

Flip Chip

1.4 mg

5000

Tape and reel 7”