EMIF02-MIC01F2

Ordering information

5/7

Figure 11.

Flip Chip tape and reel specification

4

Ordering information

Table 3.

Ordering information

Note:

More packing information is available in the application notes:

AN1235: “Flip Chip: package description and recommendations for use”

AN 1751: “EMI filters: Recomendations and measurements”

Figure 9.

Footprint

Figure 10.

Marking

Copper pad Diameter:

250 µm recommended, 300 µm max

Solder stencil opening: 330 µm

Solder mask opening recommendation:

340 µm min for 300 µm copper pad diameter

x

y

x

w

z

w

Dot, ST logo

xx = marking

z = manufacturing location

yww = datecode

(y = year

ww = week)

E

Dot identifying Pin A1 location

User direction of unreeling

All dimensions in mm

4 ± 0.1

1.56

4 ± 0.1

Ø 1.5 ± 0.1

0.73 ± 0.05

Order code

Marking

Package

Weight

Base qty

Delivery mode

EMIF02-MIC01F2

GB

Flip Chip

3.8 mg

5000

Tape and reel (7”)