Ordering information

EMIF02-SPK01C2

6/7

Figure 12.

Flip-Chip tape and reel specification

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a lead-free second level interconnect. The category of

second level interconnect is marked on the inner box label, in compliance with JEDEC

Standard JESD97. The maximum ratings related to soldering conditions are also marked on

the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available

at: www.st.com.

4

Ordering information

5

Revision history

Dot identifying Pin A1 location

User direction of unreeling

All dimensions in mm

4 ± 0.1

4 ± 0.1

Ø 1.5 ± 0.1

0.73 ± 0.05

xxz

yww

ST

xxz

yww

ST

xxz

yww

ST

E

E

E

Ordering code

Marking

Package

Weight

Base qty

Delivery mode

EMIF02-SPK01C2

FX

Flip-Chip

2.3 mg

5000

7” Tape and reel

Date

Revision

Changes

26-Jan-2006

1

Initial release.