Ordering information

EMIF02-USB03F2

6/8

Figure 15.

Flip Chip tape and reel specification

Note:

More information is available in the application notes:

AN1235:"Flip Chip: Package description and recommendations for use"

AN1751: “EMI filters: Recommendations and measurements”

5

Ordering information

Figure 13.

Footprint

Figure 14.

Marking

Copper pad Diameter:

250 µm recommended, 300 µm max.

Solder stencil opening:

330 µm recommended

Solder mask opening recommendation:

340 µm min. for 300 µm copper pad diameter

E

x

y

x

w

z

w

Dot, ST logo

xx = marking

z = manufacturing location

yww = datecode

(y = year

ww = week)

Dot identifying Pin A1 location

User direction of unreeling

All dimensions in mm

4 ± 0.1

4 ± 0.1

Ø 1.5 ± 0.1

0.73 ± 0.05

2.17

Table 3.

Ordering information

Order code

Marking

Package

Weight

Base qty

Delivery mode

EMIF02-USB03F2

FU

Flip Chip

4.5 mg

5000

Tape and reel 7”