EMIF03-SIM02M8

Package information

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4

Package information

●

Epoxy meets UL94, V0

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a lead-free second level interconnect. The category of

second level interconnect is marked on the inner box label, in compliance with JEDEC

Standard JESD97. The maximum ratings related to soldering conditions are also marked on

the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available

at: www.st.com.

Table 3.

QFN 1.7 x 1.5 package dimensions

Ref

Dimensions

Millimeters

inches

MIN

TYP

MAX

MIN

TYP

MAX

A

0.50

0.55

0.60

0.20

0.22

0.24

A1

0.00

0.02

0.05

0.00

0.01

0.02

b

0.15

0.18

0.25

0.06

0.07

0.10

D

1.70

0.67

D2

0.9

1.00

1.10

0.35

0.39

0.43

E

1.50

0.59

E2

0.30

0.40

0.50

0.12

0.16

0.24

e

0.40

0.16

k

0.20

0.08

L

0.25

0.30

0.35

0.10

0.12

0.14

Figure 13.

Footprint (dimensions in mm) Figure 14.

Marking

Dot: Pin 1 Identification

HA