Characteristics

EMIF09-SD01F3

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1

Characteristics

Figure 2.

Device configuration

GND bumps (GND_H and GND_C - A3, D3 and E3) must be connected to ground on the

printed circuit board for ESD testing and RF measurements.

Table 1.

Pin-signal attribution

Pin

Description

Pin

Description

Pin

Description

Pin

Description

Pin

Description

A1

DATA2

B1

CD

C1

DAT3_PD

D1

WP+CD

E1

DATA1

A2

DATA3

B2

CMD

C2

WP

D2

CLK

E2

DATA0

A3

GND_H

B3

C3

DAT3_PU

D3

GND_C

E3

GND_C

A4

SDDATA2

B4

SDCD

C4

SDWP

D4

SDWP+CD

E4

SDDATA1

A5

SDDATA3

B5

SDCMD

C5

VSD

D5

SDCLK

E5

SDDATA0

Table 2.

Absolute ratings (limiting values)

Symbol

Parameter

Value

Unit

Internal pins (A1, B1, C1, D1, E1, A2, B2, C2, D2, E2, C3)

ESD discharge IEC 61000-4-2, air discharge

ESD discharge IEC 61000-4-2, contact discharge

External pins (A4, B4, C4, D4, E4, A5, B5, C5, D5, E5)

ESD discharge IEC 61000-4-2, air discharge

ESD discharge IEC 61000-4-2, contact discharge

2

2

15

8

kV

Junction temperature

125

°C

Operating temperature range

-30 to + 85

°C

Storage temperature range

-55 to 150

°C

GND_C

GND_H

VSD

SDCLK

SDCMD

SDDATA0

SDDATA1

SDDATA2

SDDATA3

SDCD

SDWP

SDWP+CD

CLK

CMD

DATA0

DATA1

DATA2

DATA3

CD

WP

WP+CD

DAT3_PD

R1

R2

R3

R4

R5

R6

R7

R8

R9

R21

DAT3_PU

GND_C

GND_H

VSD

SDCLK

SDCMD

SDDATA0

SDDATA1

SDDATA2

SDDATA3

SDCD

SDWP

SDWP+CD

CLK

CMD

DATA0

DATA1

DATA2

DATA3

CD

WP

WP+CD

DAT3_PD

R1

R2

R3

R4

R5

R6

R7

R8

R9

R21

DAT3_PU