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T835H 数据表(PDF) 4 Page - STMicroelectronics |
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T835H 数据表(HTML) 4 Page - STMicroelectronics |
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4 / 10 page ![]() Characteristics T835H, T850H 4/10 Figure 3. RMS on-state current versus ambient temperature (Epoxy printed circuit board FR4, copper thickness = 35 µm) Figure 4. Variation of thermal impedance versus pulse duration 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 0 25 50 75 100 125 150 I T(RMS) (A) α=180 ° D²PAK S CU=1 cm² Tamb(°C) 1.0E-01 1.0E+00 1.0E+01 1.0E+02 1.0E-03 1.0E-02 1.0E-01 1.0E+00 1.0E+01 1.0E+02 1.0E+03 Zth(°C/W) Zth(j-a) Zth(j-c) tP(s) Figure 5. On-state characteristics (maximum values) Figure 6. Surge peak on-state current versus number of cycles 1 10 100 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 ITM(A) T j=25 °C T j=150 °C T j max. : V t0 = 0.80 V R d = 52 mΩ VTM(V) 0 10 20 30 40 50 60 70 80 90 1 10 100 1000 I TSM(A) Non repetitive T j initial=25 °C Repetitive T c=125 °C One cycle t=20ms Number of cycles Figure 7. Non-repetitive surge peak on-state current for a sinusoidal pulse with width tp < 10 ms and corresponding value of I2t Figure 8. Relative variation of gate trigger current, holding current and latching current versus junction temperature (typical values) 10 100 1000 10000 0.01 0.10 1.00 10.00 I TSM(A), I²t (A²s) Tj initial=25 °C dI/dt limitation: 50 A/µs I TSM I²t tP(ms) 0.0 0.5 1.0 1.5 2.0 2.5 -40 -20 0 20 40 60 80 100 120 140 160 I GT,IH,IL [Tj] / IGT,IH,IL [Tj=25°C] I GT I H & IL Tj(°C) |
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