Detailed description

LD3980

10/16

The device's pins perform the dual function of providing an electrical connection as well as

channeling heat away from the die. Use wide circuit-board traces and large, solid copper

polygons to improve power dissipation. Using multiple vias to buried ground planes further

enhances thermal conductivity.

6.5

Output capacitance

The device is specifically designed to employ ceramic output capacitors as low as 1µF.

Ceramic capacitors below 10µF offer significant cost and space savings, along with high

frequency noise filtering. Higher values and other types of capacitor may be used, but their

equivalent series resistance should be maintained in the range of the table.