LIS344AL

Package Information

13/15

5

Package Information

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a lead-free second level interconnect. The category of

second Level Interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an ST trademark.

ECOPACK specifications are available at: www.st.com.

Figure 5.

LGA 16: mechanical data & package dimensions

Dimensions

Ref.

mm

inch

Min. Typ. Max. Min.

Typ.

Max.

A1

1.500

1.600

0.05910.0630

A2

1.330

0.0524

A3

0.160

0.200

0.240 0.0063 0.0079 0.0094

d0.300

0.0118

D1

3.850

4.000

4.150 0.1516 0.1575 0.1634

E1

3.850

4.000

4.150 0.1516 0.1575 0.1634

L2

1.950

0.0768

M

0.100

0.0039

N1

0.650

0.0256

N2

0.9800.0386

P1

1.750

0.0689

P2

1.525

0.0600

T1

0.400

0.0157

T2

0.300

0.0118

k

0.050

0.0020

LGA16L (4x4x1.5mm)

Land Grid Array Package

Outline and

7974136D

mechanical data