Package information

TS4994FC

32/35

5

Package information

In order to meet environmental requirements, STMicroelectronics offers these devices in

category of second level interconnect is marked on the package and on the inner box label,

in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an STMicroelectronics

Flip-chip package (9 bumps)

Dimensions in millimeters unless otherwise indicated.

Figure 99.

Pinout (top view)

Figure 100. Marking (top view)

* Balls are underneath

V

IN+

V

O-

V

CC

V

IN-

V

O+

Gnd

1

2

3

76

5

4

8

Bypass

Stdby

Stdby Mode

9

V

IN+

V

O-

V

CC

V

IN-

V

O+

Gnd

1

2

3

76

5

4

8

Bypass

Stdby

Stdby Mode

9

A94

YWW

E

A94

YWW

E