Package information

TS4990

26/32

Figure 69.

TS4990 footprint recommendations

Figure 70.

Tape and reel specification (top view)

Device orientation

The devices are oriented in the carrier pocket with pin number A1 adjacent to the sprocket

holes.

Pad in Cu 18

μm with Flash NiAu (2-6μm, 0.2μm max.)

150

μm min.

500

μm

500

μm

Φ=250μm

Φ=400μm typ.

75µm min.

100

μm max.

Track

Non Solder mask opening

Φ=340μm min.

Pad in Cu 18

μm with Flash NiAu (2-6μm, 0.2μm max.)

150

μm min.

500

μm

500

μm

Φ=250μm

Φ=400μm typ.

75µm min.

100

μm max.

Track

Non Solder mask opening

Φ=340μm min.

User direction of feed

A

1

A

1

8

Die size X + 70µm

4

1.5

4

All dimensions are in mm

User direction of feed

A

1

A

1

A

1

A

1

8

Die size X + 70µm

4

1.5

4

All dimensions are in mm